Temporary Bonding Adhesive Remover
Applications
Temporary bonding adhesive cleaner is designed for the efficient removal of temporary bonding adhesive residues after debonding processes. It provides excellent dissolution capability with minimal substrate damage.
Features
- Non-NMP/NEP/DMSO solvent system
- Low metal etching rate
- Non-damaging to PSPI and molding compounds
Specifications
Metal type | ECP Cu | PVD Cu | ECP Sn | ECP Ni |
|---|---|---|---|---|
Test condition | 60⁰C | |||
Etching rate(Å/min) | <5 | <5 | <5 | <5 |
*ECP : Electrochemical Plating
*PVD : Physical Vapor Deposition