Temporary Bonding Adhesive
Applications
A temporary bonding adhesive designed for advanced packaging applications, including Fan-Out and 2.5D packaging. It delivers excellent adhesion stability during subsequent thermal, mechanical, and chemical processes, with superior resistance to delamination and adhesive overflow during high-temperature baking.
Combined with a laser release layer, the adhesive enables efficient debonding from glass carriers and clean removal through wet processing, providing excellent process reliability and manufacturability.
Features
- Good mechanical properties
- Good thermal resistance
- Easy to be cleaned by cleaner
Specifications
Product Name | LTBA series | Remarks | ||
|---|---|---|---|---|
Thickness | μm | 10~120 | ||
Recommend Process Conditions | Pre-bake | °C ; min | 100；5 | |
Post-bake | °C ; min | 140~230；30 | Post-bake temperature: Determined according to downstream process temperature requirements | |
Bonding temperature | °C | 120~180 | Bonding with flat surfaces: 120°C Bonding with structured surfaces: 180°C | |
Bonding pressure | kg/cm2 | 2.5 | ||
Bonding time | min | 5 | ||
Mechanical properties | Young's modulus | GPa | 0.8~1 | By universal tensile testing machine |
Heat resistance | 5% Weight Loss Temperature (Td) | °C | >350 | By TGA |
Modulus at 180℃ | MPa | >3 | By DMA (tensile) | |
Modulus at 260℃ | MPa | >2.5 | By DMA (tensile) | |
Cleaning method | - | Wet cleaning | ||