Strippers/Removers

Applications

Daxin’s stripping solutions effectively dissolve and remove photoresists (PR) before and after development, as well as post-etch and post-ash residues (PER/PAR) in IC manufacturing processes. Engineered to protect various metals and silicon-containing substrates, ensuring the integrity and material properties of substrates remain intact after cleaning.
Furthermore, in response to next-generation process developments, Daxin Materials offers customized specialty removal solutions tailored to micro-patterning requirements—addressing challenges such as interface inter-mixing and selective deposition architectures. Our formulations excel in removing metal-organic materials as well as organic and inorganic films modified by process steps (e.g., dry etching).