Laser Release Layer

Applications

Temporary bonding of  wafer to glass carrier has emerged as a viable method forvarious electronic device processing. Laser debonding enables the use of laser release layer (RL)that can withstand high temperatures above 300°C. The processed devices are finally debonded and separated from the carriers easily.

Features

• Excellent thermal resistance and stability >300°C

• Easily stripping by laser

• Applicable under various laser wavelength (308/355/532/1064nm) with high absorption

• Optical alignment (Tunable IR absorption or transmittance)

• Excellent chemical resistance

Specifications