Applications

With the development of new-generation process technologies, the 3D structures in semiconductor processesare constantly evolving, and the materials in integrated circuits are becoming more complex.To address the inter-mixing between different materials and the development of selective depositionstructures, Daxin provides customized removers to meet the needs of microstructure fabrication, which caninclude the removal of metal-organic materials and the by-products formed during the dry etching process.

Features

1. High wettability
2. High selectivity
3. Customized materials design
4. Low inter-mixing effect
5. High purity/Low metal ions