Product
Photosensitive Dielectric/Pass
Photosensitive Dielectric/Pass
Dielectric for Redistribution
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Applications |
Varnish-type photosensitive dielectrics for the advanced chip packaging (WLP/PLP) are designed, which could be spin or slit-coated into thin film on the substrate and is photosensitive, able to be patterned into multi-layer redistribution layer (RDL). Low curing temperature, excellent Cu adhesion and electric properties are achieved for the varying chip applications.
Specifications
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Product Name |
PD series |
RPH series |
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Features |
NMP free Good mechanical properties |
NMP free Low curing temperature |
NMP free Low Df |
NMP free Low viscosity |
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Development |
Solvent |
Solvent |
Solvent |
Solvent |
Aqueous |
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Patterning |
Negative |
Negative |
Negative |
Negative |
Positive |
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Structure |
Polyimide |
Polyimide |
Polyimide |
Polyimide |
PSPBO |
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Curing temp./time |
oC/time |
360/1h |
230/1h |
180/3h |
230/1h |
250/1h |
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Application Example |
Buffer Coating Flip Chip |
Fan-out |
Fan-out |
Panel |
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