Product
Laser Release Layer
Laser Release Layer
Release Layer For Transfer Bon
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Applications |
It is used in temporary bonding & debonding process for wafer/panel level packaging (WLP/PLP).It offers stable adhesion through subsequently physical or chemical processes. It can be debondedby laser easily.
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Features |
- Can be used with multiple laser wavelengths.
- High absorption efficiency.
- Excellent chemical resistance
