Applications

Temporary bonding of wafer to glass carrier has emerged as a viable method for various electronic device processing. Laser debonding enables the use of laser release layer (RL) that can withstand high temperatures above . The processed devices are finally debonded and separated from the carriers easily.

Features

1. Excellent thermal resistance and stability over 300° C
2. Easily stripped by laser
3. Applicable under various laser wavelength (308/355/532/1064nm) with high absorption
4. Optical alignment (Tunable IR absorption or transmittance)

Specifications