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Applications |
Photo Overcoat is applied in touch sensors as a dielectric layer and as an insulating layer. It is applied to shield underlying ITO patterns of touch panels. Daxin provides low temperature photo overcoat that is used for on-cell or G/F touch sensors. In particular, post-bake temperatures can be decreased to 120~150℃ during this manufacturing process.
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Features |
- Optical Properties: High Transmission and Intense Color Hues
- Large Process Window: Smooth and Straightforward Coating
- High Sensitivity
- Outstanding Adhesion to Bare Glass, ITO and Metal Substrates
- Excellent Chemical Resistance and Scratch Resistance
New: Low Temperature Curing Photo Overcoat (post baking 120℃~150℃) for On-Cell or G/F Touch Sensor Process
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Specifications |
| Product Name |
POCA |
POCH |
POCL |
Remarks |
| Field of Application |
General POC |
High Refractive Index |
Low Temperature Curing |
|
| Spin Type |
Slit & Spin Type |
Spinless Type |
|
| Features |
Used to Roller Coater |
High Sensitivity
Used to exposure without J and K line
Long Q-time |
|
High Sensitivity |
Long Q-time |
High Sensitivity
Long Q-time |
High Sensitivity
High Refractive Index |
Post-baking at 120°C~150°C |
|
| Viscosity |
cP |
11.0±2.0 |
9.2±0.5 |
7.0±1.0 |
4 - 7±1 |
3.4±0.5 |
3.0±0.5 |
2.5±0.5 |
3.0±0.5 |
at 25°C, 60rpm |
| Non-Volatile Matter Content |
% |
30.0±2.0 |
29.9±1.0 |
25.5±1.0 |
18 - 25±1 |
18.1±1.0 |
16.1±0.5 |
4.0±0.5 |
14.0±0.5 |
|
| Process Conditions |
Soft-Bake |
°C ; sec |
90-110 ; 90 |
80-110 ; 90 |
90-110 ; 90 |
90-110 ; 90 |
80-110 ; 90 |
80-110 ; 90 |
70-100 ; 90 |
80-100 ; 90 |
|
| Exposure Energy |
mJ/cm2 |
150-200 |
100-150 |
150-200 |
50-100 |
50-100 |
50-100 |
100-200 |
50-100 |
|
| Mask |
|
Soda-lime & Quartz |
Quartz |
Soda-lime & Quartz |
Soda-lime & Quartz |
Soda-lime & Quartz |
Soda-lime & Quartz |
Soda-lime & Quartz |
Soda-lime & Quartz |
|
| Development at 23°C |
|
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
KOH/ TMAH |
|
| Hard-Bake |
°C; min |
220-240 ; 30 |
220-240 ; 30 |
220-240 ; 30 |
220-240 ; 30 |
220-240 ; 30 |
220-240 ; 30 |
220-240 ; 30 |
120-150 ; 30 |
|
| Transmittance at 400nm |
% |
> 95 |
> 95 |
> 95 |
> 95 |
> 95 |
> 95 |
> 95 |
> 95 |
UV visible (Carry 300) |
| Refractive Index at 633nm |
|
1.51-1.52 |
1.51-1.52 |
1.51-1.52 |
1.51-1.52 |
1.51-1.52 |
1.51-1.52 |
1.65-1.75 |
1.51-1.52 |
MP100-M |
| Surface Resistivity |
Ω/ □ |
1x1014 |
1x1014 |
1x1014 |
1x1014 |
1x1014 |
1x1014 |
1x1014 |
1x1014 |
|
| Dielectric Constant |
|
4.3 |
4.3 |
4.3 |
4.3 |
4.3 |
4.3 |
4.7 |
4.3 |
f=10 K Hz, 1V |
| Hardness |
|
3H |
4H |
3H |
4H |
3H |
4H |
< H |
< H |
JIS pencil hardness |
| Shrinkage |
% |
92±2.0 |
92±2.0 |
90±2.0 |
88±2.0 |
90±2.0 |
90±2.0 |
90±2.0 |
|
250 °C* 60min 加烤 |
| Remainder |
% |
87±3.0
(200mJ/cm2) |
83±3.0
(100mJ/cm2) |
84±3.0
(200mJ/cm2) |
85±3.0
(100mJ/cm2) |
88±3.0
(100mJ/cm2) |
85±3.0
(100mJ/cm2) |
85±3.0
(100mJ/cm2) |
85±3.0
(100mJ/cm2) |
THK ratio of before/after Hard-Bake |
| HT/HH (65℃/90%, 240hrs) |
Adhesion on Glass
Adhesion on ITO |
|
5B |
5B |
5B |
5B |
5B |
5B |
5B |
5B |
ASTM-D3359 |
| Adhesion on Metal |
|
4B |
4B |
4B |
4B |
4B |
4B |
4B |
4B |
| Chemical Resistance |
|
5B |
5B |
5B |
5B |
5B |
5B |
5B |
5B |
ASTM-D3359 After Aqua Regia/ Al Acid/ Oxalic Acid/ 5% NaOH |
